copper(l) iodide; potassium carbonate; palladium diacetate in N,N-dimethyl-formamide T=150°C; 0.25 h; microwave irradiation;

pyridine; oxygen; potassium carbonate; copper(I) bromide in toluene T=80°C; P=760.051 Torr; 16 h; Schlenk technique;

1: 1-naphthylCHNOH With trifluorormethanesulfonic acid; silica gel in toluene T=50°C; 0.5 h; 2: phenylacetylene in toluene T=70°C; 3.5 h; 3: With CuCl2·2H2O; lithium chloride monohydrate; oxygen; 2,3-dicyano-5,6-dichloro-p-benzoquinone in 1,4-dioxane; propan-1-ol; toluene T=60°C; P=9750.98 Torr; 4 h;

bis-triphenylphosphine-palladium(II) chloride; n-butyllithium in tetrahydrofuran; diethyl ether; hexane 1 h; Heating;

sulfuric acid

1: KOH-solution 2: concentrated sulfuric acid View Scheme