1-甲氧基甲基-4-甲基萘合成路线 （共 11 条）
反应条件
methanol
Irradiation; Yields of byproduct given;
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1989 , vol. 111, # 24 p. 8948 - 8950
反应条件
1: dimethylformamide / 6 h / Heating
2: 2.5 M NaOH / ethanol / 24 h / Heating
3: 90 percent / BH3 / tetrahydrofuran / 1 h / Ambient temperature
4: 1.) NaH4 / 1.) DMF, 2.) DMF
View Scheme
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1993 , vol. 115, # 6 p. 2180 - 2190
反应条件
1: 90 percent / BH3 / tetrahydrofuran / 1 h / Ambient temperature
2: 1.) NaH4 / 1.) DMF, 2.) DMF
View Scheme
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1993 , vol. 115, # 6 p. 2180 - 2190
反应条件
1: 2.5 M NaOH / ethanol / 24 h / Heating
2: 90 percent / BH3 / tetrahydrofuran / 1 h / Ambient temperature
3: 1.) NaH4 / 1.) DMF, 2.) DMF
View Scheme
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1993 , vol. 115, # 6 p. 2180 - 2190
反应条件
methanol; amberlyst-15
T=25°C; 2 h;
参考文献
Jefford, Charles W.; Rossier, Jean-Claud; Kohmoto, Shigeo; Boukouvalas, John
Helvetica Chimica Acta, 1985 , vol. 68, p. 1804 - 1814
反应条件
amberlyst-15
T=25°C; 2 h;
参考文献
Jefford, Charles W.; Rossier, Jean-Claud; Kohmoto, Shigeo; Boukouvalas, John
Helvetica Chimica Acta, 1985 , vol. 68, p. 1804 - 1814
反应条件
1.) NaH4
1.) DMF, 2.) DMF; Multistep reaction;
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1993 , vol. 115, # 6 p. 2180 - 2190
反应条件
amberlyst-15; 4 A molecular sieve in tetrahydrofuran
T=25°C; 24 h;
参考文献
Jefford, Charles W.; Rossier, Jean-Claud; Kohmoto, Shigeo; Boukouvalas, John
Helvetica Chimica Acta, 1985 , vol. 68, p. 1804 - 1814
参考文献
Jefford, Charles W.; Rossier, Jean-Claude; Kohmoto, Shigeo; Boukouvalas, John
Journal of the Chemical Society, Chemical Communications, 1984 , # 22 p. 1496 - 1497
反应条件
Irradiation; Yield given;
参考文献
DeCosta, Dayal P.; Pincock, James A.
Journal of the American Chemical Society, 1989 , vol. 111, # 24 p. 8948 - 8950
