4-碘-3-甲基苯甲酸甲酯合成路线 （共 8 条）
反应条件
sulfuric acid in methanol; ethyl acetate
反应条件
sulfuric acid Heating;
参考文献
Blaszykowski, Christophe; Aktoudianakis, Evangelos; Bressy, Cyril; Alberico, Dino; Lautens, Mark
Organic Letters, 2006 , vol. 8, # 10 p. 2043 - 2045
参考文献
Della Ca, Nicola; Motti, Elena; Mega, Antonio; Catellani, Marta
Advanced Synthesis and Catalysis, 2010 , vol. 352, # 9 p. 1451 - 1454
反应条件
1: With isopropylmagnesium chloride in tetrahydrofuran T=-25 - -10°C; 1.41667 h; 2: With boric acid trimethyl ester in tetrahydrofuran T=-20 - 0°C; 1.05 h; 3: With phosphoric acid; water in tetrahydrofuran T=-20 - 20°C;
参考文献
MERCK and CO., INC.
Patent: WO2008/82567 A1, 2008 ;
Location in patent: Page/Page column 6 ;
反应条件
copper diacetate; triphenyl-phosphine oxide; silver(l) oxide T=125°C; 72 h;
参考文献
Song, Ren-Jie; Wu, Ji-Cheng; Liu, Yu; Deng, Guo-Bo; Wu, Cui-Yan; Wei, Wen-Ting; Li, Jin-Heng
Synlett, 2012 , vol. 23, # 17 p. 2491 - 2496,6
反应条件
1: methyl 3-methyl-4-iodobenzoate With isopropylmagnesium chloride in tetrahydrofuran
T=-20°C; 2 h;
2: 2,7-difluoro-3,6-bis(2-methoxyethoxymethoxy)xanthen-9-one in tetrahydrofuran
T=-20 - 22°C; 16 h;
3: With trifluoroacetic acid in dichloromethane
T=22°C; 2 h;
参考文献
Mottram, Laurie F.; Boonyarattanakalin, Siwarutt; Kovel, Rebecca E.; Peterson, Blake R.
Organic Letters, 2006 , vol. 8, # 4 p. 581 - 584
反应条件
1.1: i-PrMgCl / tetrahydrofuran; hexane / 2 h / -15 °C
1.2: 95 percent / tetrahydrofuran; hexane / 1 h / -15 - 23 °C
2.1: 88 percent / methanesulfonic acid / CH2Cl2; diethyl ether / 6 h / 23 °C
3.1: p-TsOH / toluene / 24 h / 111 °C
View Scheme
参考文献
Mottram, Laurie F.; Maddox, Ewa; Schwab, Markus; Beaufils, Florent; Peterson, Blake R.
Organic Letters, 2007 , vol. 9, # 19 p. 3741 - 3744
反应条件
tetrakis(triphenylphosphine) palladium(0); sodium carbonate in ethylene glycol dimethyl ether; water
Reflux;
参考文献
Chang, Dong-Jo; Yoon, Eun-Young; Lee, Geon-Bong; Kim, Soon-Ok; Kim, Wan-Joo; Kim, Young-Myeong; Jung, Jong-Wha; An, Hongchan; Suh, Young-Ger
Bioorganic and Medicinal Chemistry Letters, 2009 , vol. 19, # 15 p. 4416 - 4420
