2,2,2-三氟-N-(4-硝基苯基)乙酰胺合成路线 （共 25 条）
反应条件
Cu(N,N,N'-trimethyl-N'-tetradecylethylenediamine)Cl2 in acetonitrile also in pure water; also copper acetate and nitrate salts, cetyltrimethylammonium bromide or Triton X-100 as surfactants, pH 7.0, var. concentration of reagents; Rate constant;
参考文献
Broxton; Nasser
Canadian Journal of Chemistry, 1997 , vol. 75, # 2 p. 202 - 206
反应条件
in ethylene glycol dimethyl ether; water T=70.2°C; pH 0.70; ΔH(act.); ΔS(act.); ΔG(act.); other pH -0.28-0.70; other temperature 46.3-70.4 deg C; Rate constantMechanismThermodynamic data;
参考文献
Journal of the American Chemical Society, , vol. 119, # 45 p. 10969 - 10975
反应条件
sodium hydroxide; tetrabutyl-ammonium chloride in toluene
参考文献
Synthetic Communications, , vol. 26, # 21 p. 4065 - 4080
反应条件
hydrogen; palladium 10 on activated carbon in ethyl acetate T=20°C; P=750.075 Torr; 3 h;
参考文献
SCHERING AKTIENGESELLSCHAFT
Patent: WO2004/48343 A1, 2004 ;
Location in patent: Page 102; 106 ;
WO 2004/048343 A1
反应条件
sodium hydroxide; tetrabutyl-ammonium chloride in toluene
参考文献
Synthetic Communications, , vol. 26, # 21 p. 4065 - 4080
反应条件
in pyridine
T=0 - 20°C; 18 h;
参考文献
SCHERING AKTIENGESELLSCHAFT
Patent: WO2004/48343 A1, 2004 ;
Location in patent: Page 102; 106 ;
WO 2004/048343 A1
反应条件
1: With potassium nitrate in sulfuric acid
T=16 - 20°C; 4 h;
2: With sodium hydroxide in water
T=18°C;
参考文献
CeNes Limited
Patent: EP1183243 B1, 2006 ;
Location in patent: Page/Page column 12 ;
反应条件
Bi(NO3)3·5H2O; acetic anhydride in dichloromethane
T=23°C; regioselective reaction;
参考文献
Lu, Yang; Li, Yaming; Zhang, Rong; Jin, Kun; Duan, Chunying
Tetrahedron, 2013 , vol. 69, # 45 p. 9422 - 9427
反应条件
potassium phosphate; N-methyl-2-(methylamino)ethylamine; copper(l) iodide in N,N-dimethyl-formamide
T=45°C;
参考文献
Tao, Chuan-Zhou; Li, Juan; Fu, Yao; Liu, Lei; Guo, Qing-Xiang
Tetrahedron Letters, 2008 , vol. 49, # 1 p. 70 - 75
反应条件
bis(trichloromethyl) carbonate; triethylamine in dichloromethane
T=20°C; 0.25 h;
参考文献
Han, Ki-Jong; Kim, Misoo
Letters in Organic Chemistry, 2011 , vol. 8, # 8 p. 559 - 561
