tetrabutyl-ammonium chloride; triethylamine; palladium diacetate in water; N,N-dimethyl-formamide T=100°C; Heck reaction; 60 h; Title compound not separated from byproducts.;

copper T=235 - 240°C;

copper T=235 - 240°C;

copper T=240°C; 1 h;

1: 19 percent / copper powder / 235 - 240 °C 2: 95 percent / iron (activated) / benzene / Heating 3: 1.) NaNO2, conc. H2SO4; 2.) KI / 1.) water, 0-5 deg C, 2 h; 2.) water, 0-5 deg C 4: 154 mg / copper powder / 1.) 265-270 deg C, 2 h; 2.) 270-275 deg C, 0.5 h View Scheme

cesium fluoride; tris-(o-tolyl)phosphine; bis(dibenzylideneacetone)-palladium(0) in toluene; acetonitrile T=110°C; 24 h;

bis(benzonitrile)palladium(II) dichloride; caesium carbonate; P(3,5-2F3C-C6H3)3 in toluene T=110°C; 24 h; Inert atmosphereSchlenk technique;

copper T=240°C; 1 h;