甲基2-羟基-6-甲氧基苯甲酸酯合成路线 （共 14 条）
反应条件
1,8-diazabicyclo[5.4.0]undec-7-ene in tetrahydrofuran T=0 - 23°C; 19 h;
参考文献
Scheufler; Maier
Synlett, 2001 , # 8 p. 1221 - 1224
反应条件
1: With boron trichloride in dichloromethane T=0°C; 21.5 h; 2: Solvolysis;
参考文献
Biagetti, Matteo; Bellina, Fabio; Carpita, Adriano; Stabile, Paolo; Rossi, Renzo
Tetrahedron, 2002 , vol. 58, # 25 p. 5023 - 5038
反应条件
triphenylphosphine; diethylazodicarboxylate in tetrahydrofuran T=25°C;
参考文献
Bass, R. J.; Banks, B. J.; Snarey, M.
Tetrahedron Letters, 1980 , vol. 21, p. 769 - 770
反应条件
sulfuric acid in methanol
参考文献
Aventis Pharma Deutschland GmbH
Patent: US6635655 B1, 2003 ;
反应条件
1: 2,6-dihydroxybenzoic acid methyl ester With potassium carbonate in N,N-dimethyl-formamide 2: methyl iodide in N,N-dimethyl-formamide T=35°C; 3 h;
参考文献
Legrand, Sacha; Nordlander, Goeran; Nordenhem, Henrik; Borg-Karlson, Anna-Karin; Unelius, C. Rikard
Zeitschrift fur Naturforschung - Section B Journal of Chemical Sciences, 2004 , vol. 59, # 7 p. 829 - 835
反应条件
1.1: nBuLi / diethyl ether; hexane / 0 - 20 °C 1.2: 74 percent / diethyl ether; hexane 2.1: 85 percent / DBU / tetrahydrofuran / 0 - 20 °C View Scheme
参考文献
Kuehnert, Sven M; Maier, Martin E
Organic letters, 2002 , vol. 4, # 4 p. 643 - 646
反应条件
1.1: 25 percent / 1,3-dicyclohexylcarbodiimide; DMAP / CH2Cl2 / 72 h / 20 °C 2.1: K2CO3 / dimethylformamide 2.2: 20 percent / dimethylformamide / 3 h / 35 °C View Scheme
参考文献
Legrand, Sacha; Nordlander, Goeran; Nordenhem, Henrik; Borg-Karlson, Anna-Karin; Unelius, C. Rikard
Zeitschrift fur Naturforschung - Section B Journal of Chemical Sciences, 2004 , vol. 59, # 7 p. 829 - 835
反应条件
sulfuric acid 24 h; Heating;
参考文献
Zhao, Jian; Larock, Richard C.
Journal of Organic Chemistry, 2007 , vol. 72, # 2 p. 583 - 588
反应条件
sulfuryl dichloride in diethyl ether 22 h; Ambient temperature;
参考文献
Elix, John A.; Gaul, Kim L.; Jiang, Hui
Australian Journal of Chemistry, 1993 , vol. 46, # 1 p. 95 - 110
反应条件
pyridine T=20°C; 20 h;
参考文献
Kuehnert, Sven M; Maier, Martin E
Organic letters, 2002 , vol. 4, # 4 p. 643 - 646
