2-[(4-硝基苯基)氨基]乙醇合成路线 （共 28 条）
反应条件
hydrogenchloride; tin
参考文献
Pharmacia and Upjohn Company LLC
Patent: EP1042295 B1, 2005 ;
Location in patent: Page/Page column 130 ;
反应条件
N-ethyl-N,N-diisopropylamine in ethanol
T=50°C;
参考文献
BAYER HEALTHCARE AG
Patent: US2010/41646 A1, 2010 ;
Location in patent: Page/Page column 10 ;
反应条件
copper(I) oxide in acetonitrile
6 h; Reflux;
参考文献
Costa, Marcio V.; Viana, Gil M.; De Souza, Thais M.; Malta, Luiz Fernando B.; Aguiar, Lucia C.S.
Tetrahedron Letters, 2013 , vol. 54, # 19 p. 2332 - 2335
反应条件
NaOD in water-d2
T=0°C; Smiles rearrangement; UV-irradiation;
参考文献
Wubbels, Gene G.; Ota, Nobutoshi; Crosier, Michelle L.
Organic Letters, 2005 , vol. 7, # 21 p. 4741 - 4744
反应条件
sodium carbonate in water
T=2 - 18°C; 2 h; Irradiation;
参考文献
Wubbels, Gene G.; Halverson, Ann M.; Oxman, Joe D.
Journal of the American Chemical Society, 1980 , vol. 102, # 14 p. 4848 - 4849
反应条件
acetic anhydride in pyridine
参考文献
Hercules Incorporated
Patent: US5663308 A1, 1997 ;
反应条件
potassium hydroxide in dimethyl sulfoxide
T=20°C; 1 h;
参考文献
Zorina, L. N.; Safiev, O. G.; Rakhmankulov, D. L.; Paushkin, Ya. M.
Doklady Chemistry, 1989 , vol. 308, # 4-6 p. 295 - 298
Dokl. Akad. Nauk SSSR Ser. Khim., 1989 , vol. 308, # 5 p. 1150 - 1154
反应条件
1: 93 percent / dimethylformamide / 1 h / 100 °C
2: 87 percent / aq. HCl / acetic acid / 16 h / Heating
3: 0.01 M aq. NaOH / 33 °C / thermal Smiles rearrangement
View Scheme
参考文献
Wubbels, Gene G.; Halverson, Ann M.; Oxman, Joe D.; Bruyn, Van H. De
Journal of Organic Chemistry, 1985 , vol. 50, # 23 p. 4499 - 4504
反应条件
1: pyridine
2: hydrochloric acid, acetic acid / H2O / Heating
3: aq. sodium hydroxide / 33 °C
View Scheme
参考文献
Wubbels, Gene G.; Halverson, Ann M.; Oxman, Joe D.
Journal of the American Chemical Society, 1980 , vol. 102, # 14 p. 4848 - 4849
反应条件
1: dimethylformamide
2: pyridine
3: hydrochloric acid, acetic acid / H2O / Heating
4: aq. sodium hydroxide / 33 °C
View Scheme
参考文献
Wubbels, Gene G.; Halverson, Ann M.; Oxman, Joe D.
Journal of the American Chemical Society, 1980 , vol. 102, # 14 p. 4848 - 4849
